Wafer for Semiconductor and Microsystems Applications
From 3” up to 8“
Standard Dimensions from 3” up to 9” square, Thickness 90 mil up to 250 mil
Customized Dimension on user request
Software Tools for
Post layout verification and Mask Data Generation
Plasma process optimization to achieve pattern fidelity in the nanometer regime.
Basic functions have been developed within the scope of the European R&D Project “Plasma etching for desired nano-feature shape and nano-texture: an advanced reactor and simulation software for feedback-loop plasma control NanoPlasma”